Surface mount devices (SMDs) usually belong to the moisture sensitive components, moisture from the atmosphere by diffusion penetration into packaging materials. When the SMD components welded on the circuit board is it through the process of temperature is 150 ℃ ~ 245℃ of reflow soldering, under high temperature condition, the rapid expansion of infiltration of moisture to produce enough steam pressure damage or destroy the LED components, thus appeared within the material plastic crack, delamination or gold wire damage such as reliability failure problem.
This series of LED products use coating has moisture-proof anti-static aluminum foil bag,handling should be avoided in the process of extrusion, packing bags of pierced happens, at the same time to prepare the necessary electrostatic protective measures. Above line homework before LED packaging already exists leakage or damaged, please stop using directly, the performance test of photoelectric packaging products with high-temperature dehumidification action again after use.
LED the SMT process, material, and application in the process of the finished product
delivery, installation, attention should be paid to prevent external force directly or indirectly ACTS on the LED lamp body, which could lead to the external force damage LED, die modulation phenomenon occurs, therefore, need to be semi-finished products, finished product handling the work of the external force protection way.
In order to avoid the reliability of the failure problem caused by moisture absorption, need to be stored in moisture proof measures LED products before welding. If moisture bag is not opened, the TOP of the SMD components save time for < 30 ℃ / 60% RH for 2 months (note: start computing time to label date as a benchmark, good in packing bag packaging is required and no leakage phenomenon without use. According to different moisture level of materials,concrete save time with specification or bags prompt accurate). Suggest don't open moisture
proof bag before assembly (except for incoming sampling), such as inevitable, with desiccant components must be immediately sealed packaging, and save the moistureproof ark (< 30 ℃ /60% RH).
Such as feed, moisture-proof anti-static aluminum foil bag unpacking, have been found damaged, perforation can be promptly returned to the original factory for high-temperature dehumidification actions; If a roll of SMDs material in the packaging once opened, not a one-time use up and workshop temperature and humidity in the qualification (< 30 ℃ / 60% RH), the remainder can be saved under the following conditions:
(1) 70 ℃, 24 h after baking dehumidification vacuum sealed packaging.
(2) if the product fail to be strictly sealed container, please contact the original supplier, returned to the exchange or high-temperature dehumidification;
SMD and PCB assembly does not need again after reflow soldering or after high
temperature process, will not make special processing requirements. If need to go through after SMT reflow soldering or any other high temperature process (including rework), due to the solder paste contains a large number of moisture, note before reflow soldering action is required to ensure that the LED products are exposed to the air time control within 2 hours.
SK6812 LED Using Guide:
http://www.normandled.com/upload/201804/SMD%20Products%20Using%20Guide.pdf
